RoHS Information
Test Certificates and materials content information are available upon request.
Introduction:
In February of 2003 the European Union released
The Restriction of Hazardous Substances in Electrical and Electronic Equipment
(RoHS) Directive (2002/95/EC) restricting the use of Lead, Cadmium, Mercury,
Hexavalent Chromium and PBB/PBDE flame retardant materials in electrical
and electronic products sold in Europe beginning July 1, 2006.
Measures on the collection, treatment, recycling and disposal of waste
electrical and electronic equipment (WEEE) are set out in Directive (2002/96/EC)
of January 2003 to reduce the waste management problems linked to the
heavy metals and flame retardants referenced above.
Nemco's response to the growing demand for environmentally friendly components
began January 2004 with the introduction of optional lead-free surface
mount tantalum capacitors. All Nemco surface mount lead-free products comply
to RoHS requirements. The conversion to lead-free involves changing the
termination finish from a 90/10 Sn/Pb (tin/lead) finish to a 100% Sn matte
tin finish.
Nemco's radial leaded dipped tantalum lead-free capacitors became
available Q4/2004. Adding suffix code LF to existing part numbers ensures
a lead-free product. The termination finish on lead wires for lead-free
product will be 100% Sn matte tin. The internal joint for terminal attachment
is changed from Sn/Pb/Ag
(tin/lead/silver)
to Sn/Ag/Cu
(tin/silver/copper)
solder.
| Implementation dates of production changes |
| |
Lead-free |
RoHS Compliance |
| Surface Mount Devices (PCT, LSR) |
01/01/2004 |
01/01/2004 |
| Surface Mount Devices (MCT) |
01/01/2005 |
01/01/2005 |
| Surface Mount Devices (CGT) |
09/01/2007 |
09/01/2007 |
| Leaded Devices (TB) |
01/01/2005 |
01/01/2005 |
The change to lead-free design will have
no negative effect in the electrical parameters, solderability, reliability
or product performance.
To ensure receiving lead-free product Nemco's part numbering system has
been expanded with an optional suffix code position. Adding LF to the
end of existing Nemco part numbers will ensure a lead-free, RoHS compliant
part.
The table below lists hazardous material content.
Presence
of Restricted Ingredients within
Homogenous Materials of Lead-Free Product |
| Series |
RoHS/Elv
Status |
Cadmium |
Hexavalent
Chromium |
Lead |
Mercury |
PBBs |
PBDEs |
| |
Limit |
<0.01% |
<0.1% |
<0.1% |
<0.1% |
<0.1% |
<0.1% |
|
PCT |
Status |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
| LSR |
Status |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
| MCT |
Status |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
| CGT |
Status |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
| TB |
Status |
compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
MSL - Level 1: PCT, LSR, MCT, TB
MSL - Level 3: CGT
IPC/JEDEC Moisture Sensitivity Level (MSL)
addresses the subject of moisture absorption and retention inside the
component. The trapped moisture can vaporize and exert tremendous external
stresses when the device is subjected to sudden elevated temperature such
as board mounting. Package cracking due to such moisture induced stresses
is known as popcorn cracking. Surface mount devices are generally more
prone to popcorn cracking. IPC/JEDEC defined a standard classification
of moisture sensitivity levels representing vulnerability of the package
to popcorn cracking. MSL level 1 corresponds to packages that are most
immune to popcorn cracking regardless of exposure to moisture. MSL level
6 corresponds to packages that are most prone to moisture-induced fracture.
IPC/JEDEC J-STD-20 MSL
level 1 Classification
- Floor Life
- Time: Unlimited
- Condition - Degrees (Celsius) / Relative
Humidity: <= 30°/85%
- Soak Requirements (standard)
- Time (hours): 168 +5/-0
- Condition - Degrees (Celsius) / Relative
Humidity: 85°/85%
- Soak Requirements (accelerated)
- Time (hours): N/A
- Condition - Degrees (Celsius) / Relative
Humidity: N/A
Nemco lead-free devices are in accordance with
JEDEC Standard JESD97
category e3 terminations.
Storage and Handling
RoHS
compliant components will have the same storage and handling requirements
as non-compliant parts.
Compatability
RoHS
compliant components are backward compatible with existing leaded/non-compliant
components.
Board
Redesign
RoHS
compliant components do not require board redesign (i.e. different footprint
etc.).
Organizations/Associations
North
America:
Asia:
Europe:
