Parts with 100% Sn termination finish
(lead-free)
Legislation has been implemented worldwide to reduce the lead
content and other hazardous substances in electronic products. This
will reduce the environmental impact when such products are
discarded. Nemco offers lead-free devices which meet RoHS
requirements. Optional suffix codes have been added to our part
numbering system so either 90/10 Sn/Pb or 100% Sn (lead-free) can
be specified. The following information applies to lead-free
surface mount devices.
| Implementation dates of production changes |
| |
Lead-free |
RoHS Compliance |
| Surface Mount Devices (PCT, LSR) |
01/01/2004 |
01/01/2004 |
| Surface Mount Devices (MCT) |
01/01/2005 |
01/01/2005 |
| Surface Mount Devices (CGT) |
09/01/2007 |
09/01/2007 |
| Leaded Devices (TB) |
01/01/2005 |
01/01/2005 |
Recommended solder alloy for reflow: SnAgCu
lead-free (100% Sn) termination finish is compatible with all
common lead-free solder pastes including SnCu, SnCuAgBi, etc.
Recommended solder alloy for wave soldering:
SnCu
Recommended solder alloy for hand soldering:
SnAgCu
Backward compatibility
Lead-free parts (100% Sn termination finish) can be used in a Sn/Pb
process. The 100% Sn (Tin) termination finish is compatible with
existing Sn/Pb solder pastes / systems in use today.
Forward compatibility
Parts with Sn/Pb can be used in a lead-free process depending on the solder and solder temperature.
Solders with Bi are not compatible.
Visual standard
Lead-free solder joints are not as bright as tin-lead pastes and
the fillet may not be as large.
Resin color
The encapsulant resin color may darken due to the increase in
temperature required for the paste.
Self alignment
lead-free solder pastes do not allow the same self alignment as
lead containing systems, Standard mounting pads are acceptable, but
machine set up may need to be modified.
Lead-free termination finish 100% matte Sn (3-5 microns fused / annealed over Ni flash)
Organizations/Associations
North
America:
Asia:
Europe:
